Plasus歡迎各位造訪SVC TechCon 2018 展會號碼#629
Introducing novel EMICON pulse and HIPIMS module at SVC TechCon 2018
At the SVC TechCon 2018 show in Orlando FL, USA, PLASUS introduces its latest devolopment for advanced process control: The novel EMICON pulse and HIPIMS module combines spectroscopic plasma monitoring with the measurement of pulse voltage and pulse current in a unique setup for advanced process control of reactive high-density plasma applications.
You are inivted to learn more about this new and unique technique at the SVC TechCon 2018. Please join us at the following presentations:
Novel process control technique for reactive high-density plasmas by combining different control methods
Session: Heuréka! Post-Deadline Recent Developments
Presentation Date and Time: 5/09/2018 at 9:50 am (HU 3)
Novel EMICON module for advanced process control of reactive high-density plasma applications
Session: Vendor Innovators Showcase
Presentation Date and Time: 5/09/2018 at 1:00 pm – 3:00 pm (V 11)
Please meet us also at the industrial exhibition of the SVC TechCon 2018 conference at our booth #629. We have our latest devolopments on display and we will be happy to discuss possible applications with you. The industrial exhibition takes place on May 8th and 9th. If you register for a One Day Pass, the admission to the exhibition and the technical sessions is free!
Our products are also on display at our North-American distributor Angstrom Science Inc. at booth #428.