Cutting-Edge Plasma Monitoring Techniques for Process Development, Production Control and Machine Learning
Speaker: Dr. Thomas Schütte – PLASUS GmbH
2025/5/20 am10:10 – am10:30 TechCon 2025
隨著薄膜行業的規格要求越來越高，高產量和經濟高效的生產是這個競爭激烈的市場的主要因素。這些目標推動了對高效過程監測和控制系統的需求。此外，使用人工智慧和機器學習 （ML） 技術的數據分析近年來取得了巨大進步，引發了人們對使用這些方法進行等離子體應用診斷和控制的興趣。
EMICON等離子體監測和過程控制平臺以合理的成本和資源將不同的尖端感測器技術結合到一個系統中：具有前所未有的時間解析度的多通道光譜等離子體監測，用於即時原位膜厚測量的廣波域反射計，HIPIMS和脈衝等離子體應用中的電壓和電流的電脈衝曲線測量，來自等離子體（V-I）探頭等其他感測器的信號輸入， lambda 探頭、離子計探頭等從所有感測器採集的數據在 EMICON 系統中同時處理，並且可以組合和評估，以同時即時控制等離子體參數（如反應氣體流量或離子密度）和產品參數，即膜厚或顏色。這不僅提高了生產穩定性和產品品質，還為機械學習(ML)分析提供可靠與全面性的數據。
介紹來自不同要求苛刻的濺射和 PECVD 應用的示例，展示了 EMICON 平臺的強大優勢，該平臺結合了感測器技術等離子體監測、電氣測量和光度測量以及實時數據處理。
Name
Date
2025年5月20日 Tuesday
Time
am10:10 – am10:30
Description
Thomas Schütte, Jan-Peter Urbach, Peter Neiß, Marius Radloff, Hokuto Kikuchi, PLASUS GmbH, Mering, Germany
As specifications in the thin film industry become more and more demanding, high production yields and cost-effective production are major factors in this competitive market. These goals drive the demand for efficient process monitoring and control systems. In addition, data analysis using artificial intelligence and machine learning (ML) technologies has made tremendous progress in recent years, sparking interest in using these methods for the diagnostics and control of plasma applications.
The EMICON plasma monitoring and process control platform provides different cutting-edge sensor techniques combined in a single system at reasonable costs and resources: multi-channel spectroscopic plasma monitoring with unprecedented time resolution, broadband reflectometry for real-time in-situ layer thickness measurement, electrical pulse curve measurement of voltage and current in HIPIMS and pulsed plasma application, signal input from other sensors like plasma (V-I) probes, lambda probes, ion meter probes, etc. The acquired data from all sensors are processed simultaneously in the EMICON system and can be combined and evaluated for controlling the plasma parameters like reactive gas flow or ion density and the product parameters, i.e. layer thickness or color simultaneously and in real-time. This results not only in enhanced production stability and improved product quality but it also provides reliable and comprehensive data for ML analysis.
Examples from different demanding sputtering and PECVD applications are presented demonstrating the powerful benefits of the EMICON platform that combines sensor techniques plasma monitoring, electrical measurements and photometric measurements and real-time data processing.
Speakers
Thomas Schütte – PLASUS GmbH