PLASUS EMICON FS introduction @HiPIMS Today 2025
HiPIMS Today 2025 March 17 – 19, 2025 Welcome to join the presentation of introducing new EMICON FS by Dr.-Ing. Thomas Schütte on Monday 17th, March 2025. Please come and Continue Reading →
Category Archives: Conference
Visit us at ISSP 2024 in Kyoto!
Exhibition Schedule in Japanese Language. Breaking news: What a surprise to have Dr. Prof. Jyh-Wei Lee and his wife Dr. Bih-Show Lou as our noble guests. Update news: We are Continue Reading →
Magpuls Booth#811 at SVC 2024 TechCon 展出
Booth Number: 811 MAGPULS GmbH is an innovative company for developing and building pulsed power supplies for different plasma treating processes as reactive sputter process, HIPIMS sputtering processes, plasma nitriding, plasma Continue Reading →
PLASUS at SVC TechCon 2024 Booth# 911, Chicago
At the SVC TechCon 2024 conference from May 4 to May 9, 2024 in Chicago, IL, PLASUS will present its latest development for plasma monitoring and process control. Learn more Continue Reading →
HiPIMS Today 2023
PLASUS將於March 22nd -24th, 2023在HiPIMS Today 2023 (High-Power Impulse Magnetron Sputtering)有虛擬會議室與各位透過網路上進行各種技術上的討論，歡迎報名參加。
2023 高密度電漿鍍膜與製程控制國際論壇
2023 International Forum of High-Density Plasma Coatings and Process Control PLASUS將於2023/3/14 (Tue) 08:30~16:00 於台中逢甲大學舉辦的2023高密度電漿鍍膜與製程控制國際論壇中有一場很精彩的演講。歡迎報名參加。
HiPIMS Today 2022
邀請並歡迎各位於2022年1月25日至1月27日參加虛擬的HiPIMS Today 2022專題研討會 這項研討會針對近來HIPIMS的開發，也透過網路環境提供口語的簡報，海報的瀏覽與展示。 PLASUS在1月26日星期三(第二天)上午6:50-7:00(UTC時間)，也就是台灣時間下午2:50-3:00上線做一個工業簡報介紹適合HIPIMS應用上的最新產品開發。 主題是: Process control by simultaneous pulse shape and plasma emission monitoring 也邀請各位到PLASUS展示討論室跟專家會面討論有關於你們的應用以及了解有關於我們新的發展。 – The new SPECLINE software – Advanced and easy anaylsis of spectral data– In-situ process and Continue Reading →
Join us at SVC TechCon 2021 Virtual from May 3rd until May 7th, 2021
Join us at SVC TechCon 2021 Virtual from May 3rd until May 7th, 2021 At the SVC TechCon 2021 Virtual conference PLASUS will introduce its latest developments for advanced plasma monitoring. Continue Reading →